Case study · Semiconductors

+2.4pp yield uplift across three fabs, £10m+ annualised.

A semiconductor IDM ran inline metrology, probe and final-test data in three disconnected stacks. A unified yield-analytics platform with ML-based root-cause tooling delivered 2.4pp yield uplift on the target node in eight months.

+2.4pp
Yield uplift
3
Fabs unified
12bn
Records/month
8 mo
To uplift
Overview

From siloed fabs to shared yield loop.

Each fab had its own DW, its own yield-engineering team, and no cross-fab comparability. Root-cause work took weeks. The target was a shared platform that could surface cross-fab patterns in hours, and an ML model surface to accelerate the engineer's intuition, not replace it.

Approach.

01

Platform foundation

Databricks on AWS, open data model across inline, probe, final-test, equipment.

02

Unified ingestion

CDC from fab systems, schema alignment, lot-to-device traceability preserved.

03

Yield ML surface

Yield-prediction models per node, Shapley attribution for engineers.

04

Engineering UX

Tool built for yield engineers, not data scientists — reviewed weekly with them.

05

Rollout

Fab-by-fab, preserving each site's existing reviews while converging analytics.

+2.4pp
Yield on target node
£10m+
Annualised margin impact
3
Fabs on unified platform
<1 day
Cross-fab root cause
12bn
Records/month ingested
8 mo
To first uplift
Technology

Tools & frameworks we use.

Databricks
AWS
Iceberg
PyTorch
MLflow
Plotly Dash
Kafka
Airflow
Ready when you are

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