Engineering Services.
Embedded software, firmware, FPGA and semiconductor-adjacent engineering — for clients building the physical layer that data and AI ultimately run on.
A specialist practice for silicon-adjacent work.
Databuzz began in data and analytics. As our clients' AI, IoT and automation workloads pushed down the stack — into edge devices, accelerators, and custom silicon — we formalised an Engineering Services practice to meet them there.
This is a distinct practice from our Data & Analytics work: separate senior team, different tooling, specialist partnerships. Engagements are typically co-delivered with client engineering organisations on long-horizon programmes.
Where we operate.
Embedded software
Real-time systems, drivers, board bring-up, BSPs. C, C++, Rust. ARM Cortex-M / A, RISC-V.
Firmware & bootloaders
Secure boot, OTA update, recovery, signing, lifecycle management.
FPGA & RTL
Verilog / SystemVerilog, design & verification, IP integration, timing closure.
Semiconductor tooling & data
EDA integration, fabrication-data analytics, yield engineering, test-data management.
Safety & compliance engineering
ISO 26262 (automotive), IEC 62304 (medical), DO-178C (avionics) — evidence packages and process support.
AI-for-engineering
ML-assisted verification, yield prediction, test-vector generation, code-review copilots — where they genuinely help.
Senior, embedded, long-horizon.
Scope
Technical deep-dive, constraints, safety envelope, acceptance criteria.
Establish
Team stand-up, tooling, early deliverables, safety artefacts.
Deliver
Sprint cadence adapted to hardware release cycles.
Sustain
Long-term engineering support, knowledge management, certification evidence.
- ✓Engineering artefactsCode, tests, evidence — all reviewable, traceable, certifiable.
- ✓Safety / compliance packWhere the domain requires it — ISO 26262, IEC 62304, DO-178C.
- ✓Integration with client toolingPLM, ALM, EDA, CI for hardware.
- ✓Knowledge transferDocumentation, paired reviews, capability uplift.
- ✓Long-term support planBecause hardware ships for a decade.
Tools & frameworks we use.
A real engagement.
Semiconductor IDM — yield-analytics platform across 3 fabs.
A data platform unifying inline metrology, probe and final-test data across three fabs, paired with ML-based yield prediction. 2.4pp yield uplift on the target node within 8 months.
Read full case study